IEC 62258-5-2006 半导体压模产品.第5部分:关于电子模拟的信息要求

标准号：IEC 62258-5-2006
中文标准名称：半导体压模产品.第5部分:关于电子模拟的信息要求
英文标准名称：Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
标准类型：L55
发布日期：1999/12/31 12:00:00
实施日期：1999/12/31 12:00:00
中国标准分类号：L55
国际标准分类号：31.080.99;31.200
适用范围：This part of IEC 62258 has been developed to facilitate the production, supply and use ofsemiconductor die products, including:– wafers;– singulated bare die;– die and wafers with attached connection structures;– minimally or partially encapsulated die and wafers.This part of IEC 62258 specifies the information required to facilitate the use of electrical dataand models for simulation of the electrical behaviour and verification of the correct functionalityof electronic systems that include bare semiconductor die, with or without connectionstructures, and/or minimally packaged semiconductor die. It is intended to assist all thoseinvolved in the supply chain for die devices to comply with the requirements of IEC 62258-1and IEC 62258-2.