BS EN 61192-2-2003 钎焊电子组件的工艺要求.表面安装组件

标准号：BS EN 61192-2-2003
中文标准名称：钎焊电子组件的工艺要求.表面安装组件
英文标准名称：Workmanship requirements for soldered electronic assemblies - Surface-mount assemblies
标准类型：J33
发布日期：2003/6/25 12:00:00
实施日期：2003/6/25 12:00:00
中国标准分类号：J33
国际标准分类号：31.190
适用范围：This part of IEC 61192 specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting. It does not include metal or ceramic-based hybrid circuits in which the conductor metallization is deposited directly on a ceramic substrate or onto a ceramic-coated metal substrate.