IEC 60512-12-7-2001 电子设备用连接器 试验和测量 第12-7部分：锡焊试验 试验12g：可焊性、湿润平衡法

标准号：IEC 60512-12-7-2001
中文标准名称：电子设备用连接器 试验和测量 第12-7部分：锡焊试验 试验12g：可焊性、湿润平衡法
英文标准名称：Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests; Test 12g: Solderability, wetting balance method
标准类型：L23
发布日期：1999/12/31 12:00:00
实施日期：1999/12/31 12:00:00
中国标准分类号：L23
国际标准分类号：31.220.10
适用范围：This part of IEC 60512, when required by the detail specification, is to be used for testing connectors within the scope of IEC technical committee 48. This test may also be used for similar components when specified in a detail specification. The object of this test is to define a standard test method to assess the solderability of the terminations of a component designed for use with printed boards or for other applications using similar soldering techniques.