BS EN 60068-2-54-2006 环境试验.试验.试验Ta:使用润湿平衡法对电子部件进行软焊性测试

标准号：BS EN 60068-2-54-2006
中文标准名称：环境试验.试验.试验Ta:使用润湿平衡法对电子部件进行软焊性测试
英文标准名称：Environmental testing - Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
标准类型：A21
发布日期：2006/9/29 12:00:00
实施日期：2006/9/29 12:00:00
中国标准分类号：A21
国际标准分类号：19.040
引用标准：IEC 60068-1-1988;IEC 60068-2-20-1979;IEC 61190-1-3
适用范围：This part of IEC 60068 outlines Test Ta, solder bath wetting balance method applicable for anyshape of component terminations to determine the solderability. It is especially suitable forreference testing and for components that cannot be quantitatively tested by other methods.For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable.This standard provides the standard procedures for solder alloys containing lead (Pb) and forlead-free solder alloys.