BS EN 60664-3-2003+A1-2010 低压系统内设备的绝缘配合.防污染用涂覆,灌封或模压的使用

标准号：BS EN 60664-3-2003+A1-2010
中文标准名称：低压系统内设备的绝缘配合.防污染用涂覆,灌封或模压的使用
英文标准名称：Insulation coordination for equipment within low-voltage systems - Use of coating, potting or moulding for protection against pollution
标准类型：K30
发布日期：2003/6/9 12:00:00
实施日期：2003/6/9 12:00:00
中国标准分类号：K30
国际标准分类号：29.080.30
适用范围：This part of IEC 60664 applies to assemblies protected against pollution by the use ofcoating, potting or moulding, thus allowing a reduction of clearance and creepage distancesas described in Part 1 or Part 5.This standard describes the requirements and test procedures for two methods of protection:– type 1 protection improves the microenvironment of the parts under the protection;– type 2 protection is considered to be similar to solid insulation.This standard also applies to all kinds of protected printed boards, including the surface ofinner layers of multi-layer boards, substrates and similarly protected assemblies. In the caseof multi-layer printed boards, the distances through an inner layer are covered by therequirements for solid insulation in Part 1.This standard refers only to permanent protection. It does not cover assemblies that aresubjected to mechanical adjustment or repair.The principles of this standard are applicable to functional, basic, supplementary andreinforced insulation.