BS EN 62137-2004 环境和耐用试验.区域阵列式包装件表面安装板的试验方法FBGA、BGA、FLGA、LGA、SON和QFN

标准号：BS EN 62137-2004
中文标准名称：环境和耐用试验.区域阵列式包装件表面安装板的试验方法FBGA、BGA、FLGA、LGA、SON和QFN
英文标准名称：Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
标准类型：Z04
发布日期：2004/9/22 12:00:00
实施日期：2004/9/22 12:00:00
中国标准分类号：Z04
国际标准分类号：31.020
适用范围：This International Standard specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages. This standard tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits (hereinafter both referred to as semiconductor devices) used mainly for industrial and consumer use equipment. The test method specified in this standard is an integrated one by including the evaluation method of mounting methods, mounting conditions, printed circuit boards, soldering materials, and so on. It does not specify the evaluation method of the individual semiconductor devices. Mounting conditions, printed wiring boards, soldering materials, and so on significantly affect the result of the test specified in this standard. Therefore, the test specified in this standard shall not be regarded as the one to be used to guarantee the mounting reliability of the semiconductor devices. The test method is not necessary if there is no stress (mechanical or others) from any of the tests covered in this standard.