ISO 9455-17-2002 软钎焊剂.试验方法.第17部分:钎焊剂残留物的表面绝缘电阻梳试验和电化学迁移试验

标准号：ISO 9455-17-2002
中文标准名称：软钎焊剂.试验方法.第17部分:钎焊剂残留物的表面绝缘电阻梳试验和电化学迁移试验
英文标准名称：Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
标准类型：J33
发布日期：1999/12/31 12:00:00
实施日期：1999/12/31 12:00:00
中国标准分类号：J33
国际标准分类号：25.160.50
适用范围：This part of ISO 9455 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) solders (ISO 9453:1990, Class E). NOTE This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.