标准号:BS EN 60749-20-2009
中文标准名称:半导体器件.机械和气候试验方法.塑料包封的SMDs的抗湿及钎焊热度综合影响
英文标准名称:Semiconductor devices - Mechanical and climatic test methods - Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
标准类型:L40
发布日期:2010/1/31 12:00:00
实施日期:2010/1/31 12:00:00
中国标准分类号:L40
国际标准分类号:31.080.01
引用标准:IEC 60068-2-20-2008;IEC 60749-3;IEC 60749-35
适用范围:This part of IEC 60749 provides a means of assessing the resistance to soldering heat ofsemiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test isdestructive.