BS EN 60749-15-2010 半导体器件.机械和气候试验方法.穿孔安装设备的耐焊接温度性

标准号：BS EN 60749-15-2010
中文标准名称：半导体器件.机械和气候试验方法.穿孔安装设备的耐焊接温度性
英文标准名称：Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices
标准类型：L40
发布日期：2011/2/28 12:00:00
实施日期：2011/2/28 12:00:00
中国标准分类号：L40
国际标准分类号：31.080.01
适用范围：This part of IEC 60749 describes a test used to determine whether encapsulated solid statedevices used for through-hole mounting can withstand the effects of the temperature to whichthey are subjected during soldering of their leads by using wave soldering or a soldering iron.In order to establish a standard test procedure for the most reproducible methods, the solderdip method is used because of its more controllable conditions. This procedure determineswhether devices are capable of withstanding the soldering temperature encountered in printedwiring board assembly operations, without degrading their electrical characteristics or internalconnections.This test is destructive and may be used for qualification, lot acceptance and as a productmonitor.This test is, in general, in conformity with IEC 60068-2-20 but, due to specific requirements ofsemiconductors, the clauses of this standard apply.