BS EN 61188-5-2-2003 印制板及其组件.设计和使用.焊接(焊接区/接缝)的考虑.分立元件

标准号：BS EN 61188-5-2-2003
中文标准名称：印制板及其组件.设计和使用.焊接(焊接区/接缝)的考虑.分立元件
英文标准名称：Printed boards and assemblies - Design and use - Attachment (land/joint) considerations - Discrete components
标准类型：L30
发布日期：2003/10/16 12:00:00
实施日期：2003/10/16 12:00:00
中国标准分类号：L30
国际标准分类号：31.180
适用范围：This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of discrete electronic components. The purpose of this standard is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints. Each clause contains a specific set of clearly presented criteria providing information on the component, the component dimensions, the solder joint design and the land pattern dimensions.