标准号:IEC 60191-6-1-2001
中文标准名称:半导体器件的机械标准化 第6-1部分:表面安装半导体器件封装外形图绘制的一般规则 鸥翼引出线端的设计指南
英文标准名称:Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals
标准类型:L04;L40
发布日期:1999/12/31 12:00:00
实施日期:1999/12/31 12:00:00
中国标准分类号:L04;L40
国际标准分类号:01.100.25;31.240
适用范围:This part of IEC 60191 covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads; e.g., QFP, SOP, SSOP, TSOP, etc. which are packages classified as Form E in IEC 60191-4