IEC 60748-22-1997 半导体器件 集成电路 第22部分:实行能力批准程序的膜集成电路和混合膜集成电路分规范

标准号：IEC 60748-22-1997
中文标准名称：半导体器件 集成电路 第22部分:实行能力批准程序的膜集成电路和混合膜集成电路分规范
英文标准名称：Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
标准类型：L56
发布日期：1999/12/31 12:00:00
实施日期：1999/12/31 12:00:00
中国标准分类号：L56
国际标准分类号：31.200
适用范围：This sectional specification applies to film integrated circuits and hybrid film integrated circuits manufactured as catalogue circuits or as custom-built circuits whose quality is assessed on the basis of capability approval. The object of this specification is to present preferred values for ratings and characteristics, to select from the generic specification the appropriate tests and measuring methods, and to give general performance requirements to be used in detail specifications for film integrated circuits and hybrid film integrated circuits derived from this specification. The concept of preferred values is directly applicable to catalogue circuits but does not necessarily apply to custom built circuits. Test severities and requirements prescribed in detail specifications referring to this sectional specification are of equal or higher performance level, since lower performance levels are not permitted. Associated with this specification are one or more blank detail specifications, each referenced by an IEC number. A blank detail specification which has been completed as specified in 2.3 of this specification, forms a detail specification. Such detail specifications are used for the acceptance of a complete circuit, and the granting of capability approval for the boundaries of capability identified by the manufacturer in his capability manual and maintenance of capability approval in accordance with the IECQ system. NOTE - For test procedures two alternatives are available: Method A or method B; however, it is not permitted to change the methods between tests of method A, respectively B. In general, method A is more suitable for passive component based film integrated circuits, whereas method B is more applicable to semiconductor integrated circuit technology based film integrated circuits.