标准号:DIN EN 60749-20-2010
中文标准名称:半导体器件.机械和气候试验方法.第20部分:塑料封装的表面安装器件抗湿气和焊接热的综合影响(IEC 60749-20-2008).德文版本EN 60749-20-2009
英文标准名称:Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2008); German version EN 60749-20:2009
标准类型:L40
发布日期:1999/12/31 12:00:00
实施日期:2010/4/1 12:00:00
中国标准分类号:L40
国际标准分类号:31.080.01
引用标准:IEC 60068-2-20-2008;IEC 60749-3;IEC 60749-35
适用范围:This test method provides a means of assessing the resistance to soldering heat of plastic encapsulated surface mount devices (SMDs). This test is destructive.