BS EN 62137-1-5-2009 表面安装技术.表面安装焊接点的环境和耐受试验方法.第1-5部分:机械剪切疲劳试验

标准号：BS EN 62137-1-5-2009
中文标准名称：表面安装技术.表面安装焊接点的环境和耐受试验方法.第1-5部分:机械剪切疲劳试验
英文标准名称：Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5:Mechanical shear fatigue test
标准类型：L10
发布日期：2009/7/31 12:00:00
实施日期：2009/7/31 12:00:00
中国标准分类号：L10
引用标准：IEC 60068-1;IEC 60088-5;IEC 60194;IEC 61190-1-2-2007;IEC 61190-1-3;IEC 61249-2-7-2002;IEC 61760-1
适用范围：The test method described in this part of IEC 62137 applies to area array packages, such as BGA. This test method is designed to evaluate the fatigue life of the solder joints between component leads and lands on a substrate as shown in Figure 1. A temperature cyclic approach is generally used to evaluate the reliability of solder joints. Another method is to mechanically cycle the solder joints to shorten the testing time rather than to produce thestrains by changing temperatures. The methodology is the imposition of shear deformation on the solder joints by mechanical displacement instead of relative displacement generated by CTE (coefficient of thermal expansion) mismatch, as shown in Figure 2. In place of the temperature cycle test, the mechanical shear fatigue predicts the reliability of the solder joints under repeated temperature change conditions by mechanically cycling the solder joints. In this test method, the evaluation requires first to mount the surface mount component on thesubstrate by reflow soldering, then cyclic mechanical shear deformation is applied to thesolder joints until fracture of the solder joints occurs. The properties of the solder joints (forexample solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.