BS EN ISO 9455-17-2003 软钎焊剂.试验方法.焊剂残留物的表面绝缘电阻梳试验和电化学迁移试验
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标准号:BS EN ISO 9455-17-2003
中文标准名称:软钎焊剂.试验方法.焊剂残留物的表面绝缘电阻梳试验和电化学迁移试验
英文标准名称:Soft soldering fluxes - Test methods - Surface insulation resistance comb test and electrochemical migration test of flux residues
标准类型:J33
发布日期:2003/3/21 12:00:00
实施日期:2003/3/21 12:00:00
中国标准分类号:J33
国际标准分类号:25.160.50
适用范围:ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.
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