BS EN 60191-6-6-2001 半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则.小爆距纹间表面网格阵列(FLAG)的设计指南.术语推荐修改

标准号：BS EN 60191-6-6-2001
中文标准名称：半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则.小爆距纹间表面网格阵列(FLAG)的设计指南.术语推荐修改
英文标准名称：Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA) - Proposed amendment on terminology
标准类型：L40
发布日期：2001/9/5 12:00:00
实施日期：2001/9/5 12:00:00
中国标准分类号：L40
国际标准分类号：01.100.25;31.240
适用范围：This part of IEC 60191 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.