IEC 60749-37-2008 半导体装置.机械和气候试验方法.第37部分:用加速计的电路板级落锤试验方法

标准号：IEC 60749-37-2008
中文标准名称：半导体装置.机械和气候试验方法.第37部分:用加速计的电路板级落锤试验方法
英文标准名称：Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
标准类型：L30
发布日期：1999/12/31 12:00:00
实施日期：1999/12/31 12:00:00
中国标准分类号：L30
国际标准分类号：31.080.01
引用标准：IEC 60749-10-20002;IEC 60749-20;IEC 60749-20-1
适用范围：This part of IEC 60749 provides a test method that is intended to evaluate and compare dropperformance of surface mount electronic components for handheld electronic productapplications in an accelerated test environment, where excessive flexure of a circuit boardcauses product failure. The purpose is to standardize the test board and test methodology toprovide a reproducible assessment of the drop test performance of surface-mountedcomponents while producing the same failure modes normally observed during product leveltest.The purpose of this standard is to prescribe a standardized test method and reportingprocedure. This is not a component qualification test and is not meant to replace any systemlevel drop test that may be needed to qualify a specific handheld electronic product. Thestandard is not meant to cover the drop test required to simulate shipping and handlingrelatedshock of electronic components or PCB assemblies. These requirements are alreadyaddressed in test methods such as IEC 60749-10. The method is applicable to both areaarray and perimeter-leaded surface mounted packages.This test method uses an accelerometer to measure the mechanical shock duration andmagnitude applied which is proportional to the stress on a given component mounted on astandard board. The test method described in the future IEC 60749-401 uses strain gauge tomeasure the strain and strain rate of a board in the vicinity of a component. The detailedspecification states which test method is to be used.