IEC 60068-2-58-2005 环境试验.第2-58部分:试验.试验Td:表面安装元器件(SMD)用可焊性、耐金属化溶融和耐焊接热的试验方法

标准号：IEC 60068-2-58-2005
中文标准名称：环境试验.第2-58部分:试验.试验Td:表面安装元器件(SMD)用可焊性、耐金属化溶融和耐焊接热的试验方法
英文标准名称：Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
标准类型：A21
发布日期：1999/12/31 12:00:00
实施日期：1999/12/31 12:00:00
中国标准分类号：A21
国际标准分类号：19.040
适用范围：This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This