BS EN 60068-2-69-2007 环境测试.试验.试验Te:用润湿平衡法对表面安装设备(SMD)电子元件的软钎焊性试验

标准号：BS EN 60068-2-69-2007
中文标准名称：环境测试.试验.试验Te:用润湿平衡法对表面安装设备(SMD)电子元件的软钎焊性试验
英文标准名称：Environmental testing - Tests - Test Te - Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
标准类型：L04
发布日期：2007/7/31 12:00:00
实施日期：2007/7/31 12:00:00
中国标准分类号：L04
国际标准分类号：19.040
引用标准：IEC 60068-1;IEC 60068-2-20-1979;IEC 60068-2-20/A2-1987;IEC 60068-2-54-2006;IEC 61190-1-3-2002;ISO 683;ISO 6362
适用范围：This part of IEC 60068 outlines test Te, solder bath wetting balance method and solderglobule wetting balance method, applicable for surface mounting devices. These methodsdetermine quantitatively the solderability of terminations on surface mounting devices.IEC 60068-2-54 is also available for surface mounting devices and should be consulted ifapplicable.The procedures describe the solder bath wetting balance method and the solder globulewetting balance method and are both applicable to components with metallic terminations andmetallized solder pads.This standard provides the standard procedures for solder alloys containing lead (Pb) and forlead-free solder alloys.