BS EN 60512-12-7-2001 电子设备机电元件.基本试验程序和测量方法.软钎焊试验.试验12g.可钎焊性.湿平衡法.第7节:试验12g.可钎焊性.湿平衡法

标准号：BS EN 60512-12-7-2001
中文标准名称：电子设备机电元件.基本试验程序和测量方法.软钎焊试验.试验12g.可钎焊性.湿平衡法.第7节:试验12g.可钎焊性.湿平衡法
英文标准名称：Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Soldering tests - Test 12g - Solderability, wetting balance method - Section 7: Test 12g: Solderability, wetting balance method
标准类型：L10
发布日期：2001/8/15 12:00:00
实施日期：2001/9/15 12:00:00
中国标准分类号：L10
国际标准分类号：31.220.10
适用范围：This part of IEC 60512, when required by the detail specification, is to be used for testing connectors within the scope of IEC technical committee 48. This test may also be used for similar components when specified in a detail specification. The object of this test is to define a standard test method to assess the solderability of the terminations of a component designed for use with printed boards or for other applications using similar soldering techniques.