BS EN 60191-6-2-2002 半导体装置的机械标准化.表面安装的半导体装置封装外形图绘制的一般规则.1.5mm、1.27mm和1.00mm树脂球和引线端子封装的设计指南

标准号：BS EN 60191-6-2-2002
中文标准名称：半导体装置的机械标准化.表面安装的半导体装置封装外形图绘制的一般规则.1.5mm、1.27mm和1.00mm树脂球和引线端子封装的设计指南
英文标准名称：Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
标准类型：L50
发布日期：2002/3/29 12:00:00
实施日期：2002/3/29 12:00:00
中国标准分类号：L50
国际标准分类号：01.100.25;31.240
适用范围：This part of IEC 60191 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).