BS EN 60191-6-8-2001 半导体器件的机械标准化.表面安装半导体器件封装外形图绘制一般规则.玻璃密封陶瓷方型扁平封装设计指南

标准号：BS EN 60191-6-8-2001
中文标准名称：半导体器件的机械标准化.表面安装半导体器件封装外形图绘制一般规则.玻璃密封陶瓷方型扁平封装设计指南
英文标准名称：Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
标准类型：L90
发布日期：2001/11/16 12:00:00
实施日期：2001/11/16 12:00:00
中国标准分类号：L90
国际标准分类号：01.100.25;31.240
适用范围：This part of IEC 60191 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.