BS EN 61190-1-3-2007+A1-2010 电子组件用连接材料.电子焊接用电子级钎焊合金及有焊剂和无焊剂的固体焊料用要求

标准号：BS EN 61190-1-3-2007+A1-2010
中文标准名称：电子组件用连接材料.电子焊接用电子级钎焊合金及有焊剂和无焊剂的固体焊料用要求
英文标准名称：Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
标准类型：J33
发布日期：2007/7/31 12:00:00
实施日期：2007/7/31 12:00:00
中国标准分类号：J33
国际标准分类号：31.190
适用范围：This part of IEC 61190 prescribes the requirements and test methods for electronic gradesolder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, forelectronic soldering applications and for “special” electronic grade solders. For the genericspecifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. Thisstandard is a quality control document and is not intended to relate directly to the material'sperformance in the manufacturing processSpecial electronic grade solders include all solders which do not fully comply with therequirements of standard solder alloys and solder materials listed herein. Examples of specialsolders include anodes, ingots, preforms, bars with hook and eye ends, multiple-alloy solderpowders, etc.