BS EN 62326-4-1997 印制电路板.层间连接刚性印制电路板.分规范

标准号：BS EN 62326-4-1997
中文标准名称：印制电路板.层间连接刚性印制电路板.分规范
英文标准名称：Printed boards - Rigid multilayer printed boards with interlayer connections - Sectional specification
标准类型：L30
发布日期：1997/6/15 12:00:00
实施日期：1997/6/15 12:00:00
中国标准分类号：L30
国际标准分类号：31.180
适用范围：This part of IEC 2326 is applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which agreements between manufacturer and user are to be made. This standard provides additional information necessary to supplement the requirements of the Generic Specification, IEC 2326-1, for the printed boards intended to be accepted under the IEC Quality Assessment System for Electronic Components (IECQ). This standard establishes uniform requirements, specifies the characteristics to be assessed and the test methods to be used for quality conformance (whether by lot-by-lot inspection, process control, or periodic inspection).