ANSI/IPC 7095B-2008 BGAs用设计和组装过程的实施

标准号：ANSI/IPC 7095B-2008
中文标准名称：BGAs用设计和组装过程的实施
英文标准名称：Design and Assembly Process Implementation for BGAs
标准类型：L30
发布日期：1999/12/31 12:00:00
实施日期：1999/12/31 12:00:00
中国标准分类号：L30
国际标准分类号：31.180
适用范围：This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component types are addressed, as is the move to lead-free assembly processes. The focus on the information contained herein is on critical inspection, repair, and reliability issues associated with BGAs. Throughout this document the word 'BGA' can mean all types and forms of ball/column grid array packages.