IEC 62137-1-3-2008 表面安装技术.表面安装焊缝的环境和耐久性试验方法.第1-3部分:循环跌落试验

标准号：IEC 62137-1-3-2008
中文标准名称：表面安装技术.表面安装焊缝的环境和耐久性试验方法.第1-3部分:循环跌落试验
英文标准名称：Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
标准类型：L04
发布日期：1999/12/31 12:00:00
实施日期：1999/12/31 12:00:00
中国标准分类号：L04
国际标准分类号：31.020;31.190
引用标准：IEC 60068-1;IEC 60194;IEC 61249-2-7;IEC 61188-5;IEC 61190-1-2;IEC 61192-1;IEC 61760-1
适用范围：The test method described in this part of IEC 62137 applies to solder joints between terminalsof surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs).This test is intended to evaluate the strength of the solder joints of larger sized multi-terminalcomponents and other components in devices (e.g. handheld mobile devices) in the eventthat the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate,mounted device or design, etc.) are evaluated to assist in improving the strength of the solderjoints.