ASTM B579-1973(2004) 锡铅合金的电解沉积镀层(焊接板)

标准号：ASTM B579-1973(2004)
中文标准名称：锡铅合金的电解沉积镀层(焊接板)
英文标准名称：Standard Specification for Electrodeposited Coatings of Tin-Lead Alloy (Solder Plate)
标准类型：A29
发布日期：1999/12/31 12:00:00
实施日期：1999/12/31 12:00:00
中国标准分类号：A29
国际标准分类号：25.220.40 (Metallic coatings)
适用范围： Note 1-Some corrosion of tin-lead coatings may be expected in outdoor exposure. In normal indoor exposure, tin-lead is protective on iron, copper, and copper alloys. Corrosion may be expected at discontinuities (pits or pores) in the coating. Porosity decreases as the thickness is increased. A primary use of the tin-lead coating (solder) is with the printed circuit industry as a solderable coating and as an etch mask material.