IEC 60749-34 Edition 2.0-2010 半导体器件.机械和气候试验方法.第34部分:电力循环

标准号：IEC 60749-34 Edition 2.0-2010
中文标准名称：半导体器件.机械和气候试验方法.第34部分:电力循环
英文标准名称：Semiconductor devices.Mechanical and climatic test methods. Part 34: Power cycling
标准类型：L40
发布日期：2010/10/1 12:00:00
实施日期：2010/10/1 12:00:00
中国标准分类号：L40
国际标准分类号：31.080.01
引用标准：IEC 60747-1-2006;IEC 60747-2-2000;IEC 60747-6-2000;IEC 60749-3;IEC 60749-23
适用范围：This part of IEC 60749 describes a test method used to determine the resistance of asemiconductor device to thermal and mechanical stresses due to cycling the powerdissipation of the internal semiconductor die and internal connectors. This happens when lowvoltageoperating biases for forward conduction (load currents) are periodically applied andremoved, causing rapid changes of temperature. The power cycling test is intended tosimulate typical applications in power electronics and is complementary to high temperatureoperating life (see IEC 60749-23). Exposure to this test may not induce the same failuremechanisms as exposure to air-to-air temperature cycling, or to rapid change of temperatureusing the two-fluid-baths method. This test causes wear-out and is considered destructive.NOTE It is not the intention of this specification to provide prediction models for lifetime evaluation.