ANSI/ASTM F542-2007 电子元件及微电子元件封装用密封化合物发热温度的试验方法

标准号：ANSI/ASTM F542-2007
中文标准名称：电子元件及微电子元件封装用密封化合物发热温度的试验方法
英文标准名称：Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
标准类型：L94
发布日期：2007/5/22 12:00:00
实施日期：1999/12/31 12:00:00
中国标准分类号：L94
国际标准分类号：31.240
适用范围： This test method provides results that are related to the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached. This test method provides a means to measure the peak exothermic temperature of an encapsulating compound. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements see Section 8. Note 1There is no equivalent IEC standard.