IEC 60191-5-1997 半导体器件的机械标准化 第5部分:用于集成电路载带自动焊(TAB)的推荐值

标准号：IEC 60191-5-1997
中文标准名称：半导体器件的机械标准化 第5部分:用于集成电路载带自动焊(TAB)的推荐值
英文标准名称：Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
标准类型：L55
发布日期：1999/12/31 12:00:00
实施日期：1999/12/31 12:00:00
中国标准分类号：L55
国际标准分类号：31.200;55.060
适用范围：This part of IEC 60191 on mechanical standardization gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. This standard is applicable to the finished component supplied by a manufacturer to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).