IEC 62258-6-2006 半导体压模产品.第6部分:关于热模拟的信息要求

标准号：IEC 62258-6-2006
中文标准名称：半导体压模产品.第6部分:关于热模拟的信息要求
英文标准名称：Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
标准类型：L57
发布日期：1999/12/31 12:00:00
实施日期：1999/12/31 12:00:00
中国标准分类号：L57
国际标准分类号：31.080.99;31.200
适用范围：This part of IEC 62258 has been developed to facilitate the production, supply and use ofsemiconductor die products, including:• wafers;• singulated bare die;• die and wafers with attached connection structures;• minimally or partially encapsulated die and wafers.This part of IEC 62258 determines the information required to facilitate the use of thermaldata and models for simulation of the thermal behaviour and verification of the correctfunctionality of electronic systems that include bare semiconductor die, with or withoutconnection structures, and/or minimally packaged semiconductor die. It is intended to assistall those involved in the supply chain for die devices to comply with the requirements ofIEC 62258-1 and IEC 62258-2.