IEC 60749-11-2002 半导体器件.机械和气候试验方法.第11部分: 温度的急速变化.双液电镀槽法

标准号：IEC 60749-11-2002
中文标准名称：半导体器件.机械和气候试验方法.第11部分: 温度的急速变化.双液电镀槽法
英文标准名称：Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature; Two-fluid-bath method
标准类型：L40
发布日期：1999/12/31 12:00:00
实施日期：1999/12/31 12:00:00
中国标准分类号：L40
国际标准分类号：31.080.01
适用范围：This part of IEC 60749 defines the rapid change of temperature test method and the two-fluid-bath method. When both test methods are performed as part of a device qualification, results of air to air temperature cycling take priority over this two-fluid-bath test method. This test method may also be used, employing fewer cycles (e.g. 5 to 10 cycles), to test the effect of immersion in heated liquids that are used for the purpose of cleaning devices. This test is applicable to all semiconductor devices. It is considered destructive unless otherwise detailed in the relevant specification. In general, this rapid change of temperature and two-fluid bath method test is in conformity with IEC 60068-2-14 but, due to specific requirements of semiconductors, the clauses of this standard apply.