BS EN 61760-3-2010 表面安装技术.通孔回流(THR)焊接用组件规范的标准方法

标准号：BS EN 61760-3-2010
中文标准名称：表面安装技术.通孔回流(THR)焊接用组件规范的标准方法
英文标准名称：Surface mounting technology - Standard method for the specification of components for through hole reflow (THR) soldering
标准类型：L10
发布日期：2010/6/30 12:00:00
实施日期：2010/6/30 12:00:00
中国标准分类号：L10
国际标准分类号：31.190
引用标准：IEC 60062;IEC 60068;IEC 60068-2-20;IEC 60068-2-21;IEC 60068-2-45-1980;IEC 60068-2-58;IEC 60068-2-77;IEC 60068-2-82;IEC 60194;IEC 60286;IEC 60286-3;IEC 60286-4;IEC 60286-5;IEC 60749-20;IEC 61760-2;IEC 62090;ISO 8601
适用范围：This part of IEC 61760 gives a reference set of requirements, process conditions and relatedtest conditions to be used when compiling specifications of electronic components that areintended for usage in through hole reflow soldering technology.The object of this standard is to ensure that components with leads intended for through holereflow and surface mounting components can be subjected to the same placement andmounting processes. Hereto, this standard defines test and requirements that need to be partof any component generic, sectional or detail specification, when through hole reflowsoldering is intended. Further this standard provides component users and manufacturers witha reference set of typical process conditions used in through hole reflow soldering technology.