DIN EN 62137-2005 环境和耐久性试验.区域阵列式包装件表面安装板的试验方法FBGA、BGA、FLGA、LGA、SON和QFN

标准号：DIN EN 62137-2005
中文标准名称：环境和耐久性试验.区域阵列式包装件表面安装板的试验方法FBGA、BGA、FLGA、LGA、SON和QFN
英文标准名称：Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN (IEC 62137:2004 + Corrigendum:2005); German version EN 62137:2004
标准类型：A21
发布日期：1999/12/31 12:00:00
实施日期：2005/4/1 12:00:00
中国标准分类号：A21
国际标准分类号：31.020
适用范围：This Standard specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages an peripheral terminal type packages.