BS EN 61188-5-6-2003 印制板和组件.设计和使用.附件条件.四面带有J形引线的片状载体

标准号：BS EN 61188-5-6-2003
中文标准名称：印制板和组件.设计和使用.附件条件.四面带有J形引线的片状载体
英文标准名称：Printed boards and assemblies - Design and use - Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
标准类型：L30
发布日期：2003/6/26 12:00:00
实施日期：2003/6/26 12:00:00
中国标准分类号：L30
国际标准分类号：31.190
适用范围：This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. The object of this standard is to provide the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of resulting solder joints. Each clause contains a specific set of criteria, setting out details on the component, the component dimensions, the solder joint design and the land pattern dimensions. NOTE The acronym QFJ is the naming convention used by Japan; the acronym PLCC is the naming convention used by the USA for these components.