IEC 61188-1-1-1997 印制电路板和印制电路板组件 设计和使用 第1-1部分:一般要求 电子组件的平整度情况
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标准号:IEC 61188-1-1-1997
中文标准名称:印制电路板和印制电路板组件 设计和使用 第1-1部分:一般要求 电子组件的平整度情况
英文标准名称:Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
标准类型:L30
发布日期:1999/12/31 12:00:00
实施日期:1999/12/31 12:00:00
中国标准分类号:L30
国际标准分类号:31.190
适用范围:This part of IEC 61188 describes those factors which control the flatness of rigid printed boards and their assemblies. The object of this standard is to inform the designer, manufacturer, assembler and user of rigid printed boards and their assemblies about those factors affecting their flatness. This standard incorporates advice regarding:
- design (clause 3);
- base material (clause 4);
- unassembled printed boards (clause 5);
- printed board assemblies (clause 6).
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