DIN EN 60191-6-5-2002 半导体器件的机械标准化.第6-5部分:表面安装的半导体器件外形图纸制备的一般规则.小螺距刃片栅格排列的设计指南 (IEC 60191-6-5:2001);

标准号：DIN EN 60191-6-5-2002
中文标准名称：半导体器件的机械标准化.第6-5部分:表面安装的半导体器件外形图纸制备的一般规则.小螺距刃片栅格排列的设计指南 (IEC 60191-6-5:2001); 德文版本 EN 60191-6-5:2001
英文标准名称：Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German version
标准类型：L40
发布日期：1999/12/31 12:00:00
实施日期：2002/5/1 12:00:00
中国标准分类号：L40
国际标准分类号：01.100.25;31.240
适用范围：The document provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array (hereinafter called FBGA), whose terminals pitch is less than, or equal to 0,80 mm and whose package body outline is square.#,,#