IEC 61190-1-1-2002 电子组件用连接材料.第1-1部分:电子组件中高质量互连用助焊剂的要求

标准号：IEC 61190-1-1-2002
中文标准名称：电子组件用连接材料.第1-1部分:电子组件中高质量互连用助焊剂的要求
英文标准名称：Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
标准类型：J33
发布日期：1999/12/31 12:00:00
实施日期：1999/12/31 12:00:00
中国标准分类号：J33
国际标准分类号：25.160.50;31.190
适用范围：This part of IEC 61190 specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.