IEC 60191-6-5-2001 半导体器件的机械标准化 第6-5部分：表面安装半导体器件封装外形图绘制的一般规则 小螺距球状网格阵列（FBGA）的设计指南

标准号：IEC 60191-6-5-2001
中文标准名称：半导体器件的机械标准化 第6-5部分：表面安装半导体器件封装外形图绘制的一般规则 小螺距球状网格阵列（FBGA）的设计指南
英文标准名称：Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA)
标准类型：L04;L40
发布日期：1999/12/31 12:00:00
实施日期：1999/12/31 12:00:00
中国标准分类号：L04;L40
国际标准分类号：01.100.25;31.240
适用范围：This part of IEC 60191 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array (hereinafter called FBGA), whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square. The demand for area array style packages exists according to the multi-functioning and high performance of electrical equipment. The object of this design guide is to standardize outlines and secure interchangeability of FBGA packages. The terminal pitch and package outlines of these fine-pitch array packages are smaller than those of BGA packages.