BS EN 60749-20-1-2009 半导体器件.机械和气候试验方法.第20-1部分:对潮湿和焊接热综合效应敏感元器件的操作,包装,标识和运输

标准号：BS EN 60749-20-1-2009
中文标准名称：半导体器件.机械和气候试验方法.第20-1部分:对潮湿和焊接热综合效应敏感元器件的操作,包装,标识和运输
英文标准名称：Semiconductor devices - Mechanical and climatic test methods - Part 20-1:Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
标准类型：L40
发布日期：2009/7/31 12:00:00
实施日期：2009/7/31 12:00:00
中国标准分类号：L40
国际标准分类号：31.080.01
引用标准：IEC 60749-20;IEC 60749-30
适用范围：This part of IEC 60749 applies to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air.The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs which have been classified to the levels defined in IEC 60749-20. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags from the seal date.Two test conditions, method A and method B, are specified in the soldering heat test of IEC 60749-20. For method A, moisture soak conditions are specified on the assumption that moisture content inside the moisture barrier bag is less than 30 % RH. For method B, moisture soaking conditions are specified on the assumption that manufacturer’s exposure time (MET) does not exceed 24 h and the moisture content inside the moisture barrier bag isless than 10 % RH. In an actual handling environment, SMDs tested by method A are permitted to absorb moisture up to 30 % RH, and SMDs tested by method B are permitted to absorb moisture up to 10 % RH. This standard specifies the handling conditions for SMDs subjected to the above test conditions.