IEC 60191-1-2018 半导体器件的机械标准化.第1部分:分立器件外形图的一般规则

标准号：IEC 60191-1-2018
中文标准名称：半导体器件的机械标准化.第1部分:分立器件外形图的一般规则
英文标准名称：Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
标准类型：L40;L04
发布日期：1999/12/31 12:00:00
实施日期：1999/12/31 12:00:00
中国标准分类号：L40;L04
国际标准分类号：01.100.25;31.080.01;31.240
引用标准：IEC 60191-2-1966;IEC 60191-4-2013;IEC 60191-6-1-2001;IEC 60191-6-3-2000;IEC 60191-6-20-2010;IEC 60191-6-21-2010
适用范围：This part of IEC 60191 gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8. For the preparation of outline drawings of surface-mounted discrete devices with a lead count higher or equal to 8, IEC 60191-6 should be referred to as well. The primary object of these drawings is to indicate the space to be allowed for devices in equipment, together with other dimensional characteristics required to ensure mechanical interchangeability. Complete interchangeability involves other considerations such as the electrical and thermal characteristics of the semiconductor devices concerned. The international standardization represented by these drawings therefore encourages the manufacturers of devices to comply with the tolerances shown on the drawings in order to extend their range of customers internationally. It also gives equipment designers an assurance of mechanical interchangeability between the devices obtained from suppliers in different countries, provided they allow the space in their equipment that is indicated by the drawings and take note of the more precise information on bases, studs, etc. NOTE Additional details of reference letter symbols used in this document are given in Annex A.