BS EN 60068-2-20-2008 环境测试.试验.试验T.含铅装置热钎焊阻力和软焊性的试验方法

标准号：BS EN 60068-2-20-2008
中文标准名称：环境测试.试验.试验T.含铅装置热钎焊阻力和软焊性的试验方法
英文标准名称：Environmental testing - Part 2-20: Tests – Test T: Test methods for solderability and resistance to soldering heat of devices with leads
标准类型：A21
发布日期：2009/1/31 12:00:00
实施日期：2009/1/31 12:00:00
中国标准分类号：A21
国际标准分类号：19.040
引用标准：IEC 60068-1;IEC 60068-2-2;IEC 60068-2-66;IEC 60068-2-78;IEC 60194;IEC 61191-3;IEC 61191-4
适用范围：This part of IEC 60068 outlines Test T, applicable to devices with leads. Soldering tests forsurface mounting devices (SMD) are described in IEC 60068-2-58.This standard provides procedures for determining the solderability and resistance tosoldering heat of devices in applications using solder alloys, which are eutectic or neareutectic tin lead (Pb), or lead-free alloys.The procedures in this standard include the solder bath method and soldering iron method.The objective of this standard is to ensure that component lead or termination solderabilitymeets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition,test methods are provided to ensure that the component body can resist against the heat loadto which it is exposed during soldering.NOTE Information about wetting time and wetting force can be obtained by test methods using a wetting balance.See IEC 60068-2-54 (solder bath method) and IEC 60068-2-69 (solder bath and solder globule method for SMDs).