BS EN 61188-5-5-2007 印制电路板和印制电路板组件.设计和使用.第5-5部分:焊接(焊接区/焊缝)考虑.四面带有翅形引线的部件

标准号：BS EN 61188-5-5-2007
中文标准名称：印制电路板和印制电路板组件.设计和使用.第5-5部分:焊接(焊接区/焊缝)考虑.四面带有翅形引线的部件
英文标准名称：Printed boards and printed board assemblies - Design and use - Attachment (land/joint) considerations - Components with gull- wing leads on four sides
标准类型：L30
发布日期：2007/12/31 12:00:00
实施日期：2007/12/31 12:00:00
中国标准分类号：L30
国际标准分类号：31.180
引用标准：IEC 61188-5-1
适用范围：This part of IEC 61188 provides information on land pattern geometries used for the surfaceattachment of electronic components with gull-wing leads on four sides. The intent of theinformation presented herein is to provide the appropriate size, shape and tolerances ofsurface mount land patterns to ensure sufficient area for the appropriate solder fillet, and alsoallow for inspection, testing and reworking of those solder joints.Each clause contains a specific set of criteria such that the information presented isconsistent, providing information on the component, the component dimensions, the solderjoint design and the land pattern dimensions.The land pattern dimensions are based on a mathematical model that establishes a platformfor a solder joint attachment to the printed board. The existing models create a platform that iscapable of establishing a reliable solder alloy used to make that joint (lead-free, tin lead, etc.).Process requirements for solder reflow are different based on the solder alloy and should beanalyzed in order that the process is above that temperature a sufficient time to form areliable metallurgical bond.