BS EN 60749-21-2011 半导体装置.机械和气候耐受性试验方法.可焊性

标准号：BS EN 60749-21-2011
中文标准名称：半导体装置.机械和气候耐受性试验方法.可焊性
英文标准名称：Semiconductor devices. Mechanical and climatic test methods. Solderability
标准类型：L40
发布日期：2011/8/31 12:00:00
实施日期：2011/8/31 12:00:00
中国标准分类号：L40
国际标准分类号：31.080.01
引用标准：IEC 61190-1-2-2007;IEC 61190-1-3-2007
适用范围：This part of IEC 60749 establishes a standard procedure for determining the solderability ofdevice package terminations that are intended to be joined to another surface using tin-lead(SnPb) or lead-free (Pb-free) solder for the attachment.This test method provides a procedure for ‘dip and look’ solderability testing of through hole,axial and surface mount devices (SMDs) as well as an optional procedure for a boardmounting solderability test for SMDs for the purpose of allowing simulation of the solderingprocess to be used in the device application. The test method also provides optionalconditions for ageing.This test is considered destructive unless otherwise detailed in the relevant specification.NOTE 1 This test method is in general accord with IEC 60068, but due to specific requirements of semiconductors,the following text is applied.NOTE 2 This test method does not assess the effect of thermal stresses which may occur during the solderingprocess. Reference should be made IEC 60749-15 or IEC 60749-20.