IEC 60749-8-2002 半导体器件.机械和气候试验方法.第8部分:密封

标准号：IEC 60749-8-2002
中文标准名称：半导体器件.机械和气候试验方法.第8部分:密封
英文标准名称：Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
标准类型：L40
发布日期：1999/12/31 12:00:00
实施日期：1999/12/31 12:00:00
中国标准分类号：L40
国际标准分类号：31.080.01
适用范围：This part of IEC 60749 is applicable to semiconductor devices (discrete devices and integrated circuits) The object of this test method is to determine the leak rate of semiconductor devices. NOTE This test is identical to the test method contained in clause 5 of chapter 3 of IEC 60749 (1996), amendment 2, apart from the addition of this clause and clause 2 and the subsequent renumbering.