IEC 60068-2-54-2006 环境试验.第2-54部分:试验.试验Ta:通过润湿平衡法的电子元件的软钎焊

标准号：IEC 60068-2-54-2006
中文标准名称：环境试验.第2-54部分:试验.试验Ta:通过润湿平衡法的电子元件的软钎焊
英文标准名称：Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
标准类型：A21
发布日期：1999/12/31 12:00:00
实施日期：1999/12/31 12:00:00
中国标准分类号：A21
国际标准分类号：19.040
引用标准：IEC 60068-1-1988;IEC 60068-2-20-1979;IEC 61190-1-3
适用范围：This part of IEC 60068 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable.This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.