BS EN 60603-6-1998 印制电路板用频率低于3 MHz的连接器.标称厚度1.6 mm(0.063 in)的单面或双面印制电路板用触点间距为2.54 mm(0.1 in)的末端插座连接器和

标准号：BS EN 60603-6-1998
中文标准名称：印制电路板用频率低于3 MHz的连接器.标称厚度1.6 mm(0.063 in)的单面或双面印制电路板用触点间距为2.54 mm(0.1 in)的末端插座连接器和印制电路板连接器
英文标准名称：Connectors for frequencies below 3 MHz for use with printed boards - Edge-socket connectors and printed board connectors with 2, 54 mm (0,1 in) contact spacing for single or double-sided printed boards of 1,6 mm (0,063 in) nominal thickness
标准类型：L30
发布日期：1998/5/15 12:00:00
实施日期：1998/5/15 12:00:00
中国标准分类号：L30
国际标准分类号：31.220.10
适用范围：This standard covers a range of connectors with 2.54 mm (0.1 in) contact spacing intended to connect a single or double-sided printed board to another printed board or wires. Two kinds are available: Edge-socket connector A connector with female contacts intended to mate with edge-board contacts and with printed-board connectors having male contacts. Edge-socket connectors are available with: - solder terminations for wire; - solder terminations for board mounting; - wrap terminations. Printed-board connector A connector having male contacts which when mounted on a printed board replaces the edge-board contacts. Printed-board connectors are provided with solder terminations for single or double-sided boards of 1.6 mm (0.063 in) nominal thickness. An edge-socket connector mated with a printed-board connector is referred to as a two-part con-nector in this standard. The mandatory method of locating is by means of a guide key which replaces an opposite pair of contacts, and one such key is provided per connector (see also Sub-clause 4.5) This standard shall be used in conjunction with the following IEC publications: Nos. 50 (581) (1978): International Electrotechnical Vocabulary, Chapter 581: Electromechanical Components for Electronic Equipment. 603-1 (1981): Connectors for Frequencies Below 3 MHz for Use with Printed Boards, Part 1: General Rules and Guide for the Preparation of Detail Specifications. 512-2 (1976): Electromechanical Components for Electronic Equipment; Basic Testing Procedures and Measuring Methods, Part 2: General Examination, Electrical Continuity and Contact Resistance Tests, Insulation Tests and Voltage Stress Tests. 512-3 (1976): Part 3: Current-carrying Capacity Tests. 512-6 (1984): Part 6: Climatic Tests and Soldering Tests. 512-7 (1978): Part 7: Mechanical Operating Tests and Sealing Tests. Amendment No. 1 (1983).