DIN EN 60749-25-2004 半导体器件.机械和气候试验方法.第25部分:温度循环

标准号：DIN EN 60749-25-2004
中文标准名称：半导体器件.机械和气候试验方法.第25部分:温度循环
英文标准名称：Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling (IEC 60749-25:2003); German version EN 60749-25:2003
标准类型：L40
发布日期：1999/12/31 12:00:00
实施日期：2004/4/1 12:00:00
中国标准分类号：L40
国际标准分类号：31.080.01
适用范围：This part of DIN EN 60749 provides a test procedure for determining the ability of smiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremen. Permanent changes in electrical and/or physical characteristics can result from these stresses. This test applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.#,,#