IEC 60068-2-69-2007 环境测试.第2-69部分:试验.试验Te:用润湿称量法进行表面安装装置(SMD)的电子元件的可焊性测试

标准号：IEC 60068-2-69-2007
中文标准名称：环境测试.第2-69部分:试验.试验Te:用润湿称量法进行表面安装装置(SMD)的电子元件的可焊性测试
英文标准名称：Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
标准类型：L04
发布日期：1999/12/31 12:00:00
实施日期：1999/12/31 12:00:00
中国标准分类号：L04
国际标准分类号：19.040;31.190
适用范围：This part of IEC 60068 outlines test Te, solder bath wetting balance method and solderglobule wetting balance method, applicable for surface mounting devices. These methodsdetermine quantitatively the solderability of terminations on surface mounting devices.IEC 60068-2-54 is also available for surface mounting devices and should be consulted ifapplicable.The procedures describe the solder bath wetting balance method and the solder globulewetting balance method and are both applicable to components with metallic terminations andmetallized solder pads.This standard provides the standard procedures for solder alloys containing lead (Pb) and forlead-free solder alloys.